Systems and methods for breakaway RFID tags

ABSTRACT

A breakaway RFID tag is configured such that it comprises part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the RFID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.

RELATED APPLICATIONS INFORMATION

This present application is a continuation of U.S. patent applicationSer. No. 15/013,939, filed on Feb. 2, 2016, which claims the benefit ofpriority as a Continuation under 35 U.S.C. §120 of U.S. patentapplication Ser. No. 14/636,916, filed on Mar. 3, 2015, which claims thebenefit of priority as a Continuation under 35 U.S.C. §120 of U.S.patent application Ser. No. 14/108,216, filed on Dec. 16, 2013, whichclaims the benefit of priority as a Continuation under 35 U.S.C. §120 ofU.S. patent application Ser. No. 13/449,237, filed on Apr. 17, 2012,which claims the benefit of priority as a Continuation under 35 U.S.C.§120 of U.S. patent application Ser. No. 11/766,737, filed Jun. 21,2007, entitled “Systems and Methods for Breakaway RFID Tags,” which inturn claims the benefit of priority under 35 U.S.C. 119(e) toProvisional Patent Application Ser. No. 60/805,423, entitled “An RFIDSmart Cabinet and a Multi-Document Read Write Station,” filed Jun. 21,2006, all of which are incorporated herein by reference as if set forthin full.

BACKGROUND

1. Field of the Invention

The field of the invention relates generally to Radio FrequencyIdentification (RFID) systems and more particularly to the design andconstruction of RFID tags used for tracking the assembly of variousdevices.

2. Background of the Invention

In complex manufacturing processes, such as the manufacturing ofconsumer electronics, hundreds or even thousands of parts are assembledto make a single device. It is important to track these components asthey go through the manufacturing process. Often logs are used to trackcomponents using some form of serial number as they go through themanufacturing process; however, as smaller components get assembled intolarger components and ultimately into the end device it can be difficultto continue tracking such components. Moreover, current logging systemscan be disparate and difficult to correlate information associated witha specific component.

In certain situations, bar codes or other technology can be used toassist in tracking components as they are assembled in the manufacturingprocess. Thus, as a component comes to a new station from themanufacturing process it can be scanned, e.g., using a bar code scanner,and information related to the component can be tracked in an electronicdatabase. RFID technology has the added advantage in that line of sightis not required to effectively scan an RFID tag being used to track acomponent. Even with RFID technology, however, it can be difficult tocontinue tracking components as they are assembled in the largerassembles because even though line of sight is not required, othercomponents and circuitry can interfere with the ability to effectivelyread an RFID tag once a component associated with the tag has beenassembled into a larger device.

The inability to efficiently track components up to the device levelhinders the ability to efficiently track information that can used tospot trends, such as the failure trends, to assist in servicing faileddevices, and in keeping efficient inventory records.

SUMMARY

A breakaway RFID tag is configured such that it comprises part of aPrinted Circuit Board Assembly (PCB). Thus, the breakaway RFID tag canbe used to track the PCB as it migrates through a manufacturing process.In one embodiment, the RFID tag can be assembled first and then used totrack the PCB as it is populated with components and installed intolarger assemblies and ultimately into the end device. Once the PCB isinstalled into a larger assembly or the end device, the breakaway RFIDtag is configured such that it can be broken off and attached to theoutside of the larger assembly or end device. In this manner, the RFIDtag can be used to continue tracking the PCB all the way through the endof the manufacturing process. Accordingly, tracking information can bemore efficiently correlated and used to improve inventory tracking,failure trend spotting analysis, and to improve service by providinginformation that can quickly identify potential problems in a failedfield unit.

These and other features, aspects, and embodiments of the invention aredescribed below in the section entitled “Detailed Description.”

BRIEF DESCRIPTION OF THE DRAWINGS

Features, aspects, and embodiments of the inventions are described inconjunction with the accompanying drawings, in which:

FIG. 1 is a diagram illustrating an exemplary RFID system;

FIG. 2 is a diagram illustrating an example printed circuit boardcomprising a breakaway RFID tag in accordance with one embodiment of theinventor;

FIG. 3 is a diagram illustrating an example method for tracking anassembly process using the breakaway RFID tag of FIG. 2 in accordancewith one embodiment of the invention;

FIG. 4 is a diagram illustrating an example of assembly process for theprinted circuit board of FIG. 2; and,

FIG. 5 is a diagram illustrating a method of troubleshooting an assemblyprocess using information retrieved from the breakaway RFID tag of FIG.2.

DETAILED DESCRIPTION

FIG. 1 is a diagram illustrating an exemplary RFID system 100. As can beseen RFID system 100 comprises an RFID interrogator 102, an antenna or acoil 108, and a transponder, or RFID tag 112. RFID interrogator 102communicates with RFID tag 112 over an RF communication channel 136.RFID tag 112 can be passive or active. In the active case, RFID tag 112can comprise its own power source, which can allow it to store moreinformation. In the passive case, RFID tag 112 uses the energy in thesignal received over RF channel 136 to power up a small transpondercircuit. The transponder circuit is configured to read the instructionstransmitted by RFID interrogator over RF channel 136 and respondaccordingly. Often, the instructions received from RFID interrogator 102require the transponder circuit to read a small amount of informationstored in a memory circuit on RFID tag 112 and transmit the informationback to RFID interrogator 102 over RF channel 136. The passive RFID tag112 typically does not generate an RF signal to be transmitted over RFchannel 136. Rather, RFID tag 112 simply reflects the received RFsignal, while encoding the data retrieved from memory onto the reflectedsignal.

Thus, a passive RFID tag comprises a coil, or some form of antenna, anda transponder circuit. A transponder circuit can also include memorycircuits for use as described above. The coil or antenna can comprisetraces deposited onto a substrate in the same way that traces aredeposited onto a PCB substrate. Accordingly, an RFID tag can bemanufactured using a PCB substrate with printed traces forming theantenna or coil as well as pads configured to receive a transponder IC.In the systems and methods described below, the ability to make an RFIDtag using a PCB substrate and traces is taken advantage of to track thePCB state assembly process by manufacturing the PCBs with a breakawayRFID tag that can be used to track the PCB as components are populatedthereon and as the PCB is assembled into larger component assembliesand/or into the end device.

FIG. 2 is a diagram illustrating an example Printed Circuit Board (PCB)200 comprising a breakaway RFID tag 201 connected to main body 205 by abreakaway connection 204 in accordance with one embodiment of theinvention. Main body 205 can comprise traces for interconnecting othercomponents that are essential to the functioning of the assembled PCB200. Breakaway RFID tag 200 can comprise a printed antenna 202 and anintegrated circuit (IC) pad 203. IC pad 203 can be configured to receivean RFID transponder IC 206. Thus, IC pad 203 can be of several types,depending on the processes and technology used for a particularimplementation. For example, IC pad 206 can comprise a surface mount pador a dual axial lead pad, just to name a couple.

Accordingly, breakaway RFID tag 201 can be populated, e.g., withtransponder IC 206, before main body 205 is populated with anyassociated components. A breakaway RFID tag can then be used to begintracking information related to the assembly of main body portion 205until main body portion 205 is to be assembled into a larger componentassembly. The breakaway RFID tag can then be broken away from main bodyportion 205 by breaking breakaway connection 204. The breakawayconnection 204 can then used to continue tracking the component assemblyinto which main body portion 205 was assembled. Thus, breakawayconnection 204 can simply comprise a narrow portion of PCB substratethat can be snapped off when required. Alternatively, breakawayconnection 204 can comprise a PCB substrate that is perforated withholes in order to make it easier to snap off and break away RFID tag101. In other embodiments, breakaway connection 204 can be configuredsuch that it can be cut, i.e., using a knife, scissors, or the like, oreven sawed in order to disconnect breakaway RFID tag 201 from main bodyportion 205.

FIG. 3 is a flowchart illustrating an example method for tracking anassembly process using, e.g., breakaway RFID tag 201 in accordance withone embodiment of the systems and methods described herein. First, instep 301, a PCB 200 comprising main body portion 205, breakawayconnection 204, and breakaway RFID tag 201 is fabricated using knownfabrication techniques. Again, breakaway RFID tag 201 should at leastinclude a printed coil, or antenna, 202 and an IC pad 203. IC pad 203can be of several types, e.g., including a surface mount pad or a dualaxial lead pad. Main body portion 205 can contain pads and interconnectsfor assembling and connecting other components.

After fabricating PCB 200 with breakaway tag 201, IC pad 203 can bepopulated with an RFID transponder IC 206 in step 302. RFID transponderIC 206 can be populated onto breakaway RFID tag 201 using a number ofdifferent methods, including surface mounting or dual axial leadmounting, depending on the type of transponder IC 206 and IC pad 203.Once RFID transponder 206 has been assembled onto breakaway RFID tag201, RFID tag 201 can be scanned to record any associated identificationinformation in step 303. The recorded identification information can,for example, be used for tracking or troubleshooting as will bedescribed below. In addition to the identification information, otherinformation such as the time, can be recorded as well.

In certain embodiments, PCB 200 can then be assembled into a largerassembly without any further processing, as illustrated in step 208.Once PCB 200 is assembled into a larger assembly, breakaway RFID tag 201can be detached from main body portion 205 and attached to the exteriorsurface of the assembly, as illustrated in step 309. As mentioned above,placing breakaway RFID tag 201 on the exterior surface of the assemblyallows breakaway RFID tag 201 to continue performing its trackingfunction once main body portion 205 has been incorporated within theassembly. Thus, breakaway RFID tag 201 can be used to track the assemblyinto which main body portion 205 has been assembled. Tracking can beperformed simply by scanning, in step 310, breakaway RFID tag 201 andrecording its identifying information. In addition to the identifyinginformation for each breakaway RFID tag 201, it is possible to recordother information such as the time of the scan.

PCB 200 can, however, be subject to further assembly processes before itis incorporated into a larger assembly in step 308. For example, mainbody portion 205 can be populated with other components in multipleprocessing steps, as illustrated in step 304. After each additionalprocessing step 304, breakaway RFID tag 201, which can still be attachedto main body portion 205, can be scanned and recorded in step 305. Theadditional processing performed on the PCB 204 may consist of manysmaller steps. Thus, several additional processing steps 304 arerequired, breakaway RFID tag 301 can be scanned and information recordedafter each step.

Breakaway RFID tag 201 can also be used to track and/or record whenrepairs, or abnormal processing steps, occur in relation to main bodyportion 205. Thus, if it is determined, in step 306, that repairs areneeded, then PCB 200 can be routed to a repair station. Breakaway RFIDtag can be used to track the occurrence of the repair, e.g., scanning,in step 307, breakaway RFID tag 201 as PCB 200 enters and/or exits therepair station to record the identifying information of breakaway RFIDtag 201 and, optionally, additional information.

As should be apparent, scanning RFID tag 201 at various steps in theassembly process can enable the creation of a database of informationrelated to the assembly process for a particular PCB 200. RFID tag 201will often be a passive RFID tag and therefore comprise a limited amountof information. Accordingly, RFID tag 201 will often be used to storelittle more than an identifier associated with PCB 200; however, byintegrating the RFID scanners used to scan information from RFID tags201 with a larger tracking system, assembly operators can providedetailed information for each PCB 200 and associated with the identifierscanned from the associated RFID tag 201. For example, if a PCB 200enters a repair station, then the associated breakaway RFID tag 201 canbe scanned and then information related to the repairs can be entered,e.g., through a computer. A scanned identifier and related informationcan then be stored into a database for later retrieval and use. One suchuse, would be in servicing a failed unit that has been fielded, i.e.,sold to a consumer or end user. This is described in more detail below.

Similarly, breakaway RFID tag 201 can be used to track and/or recordrepairs to the assembly after breakaway RFID tag 201 has been attachedto the exterior of the assembly in step 309, as illustrated by step 310.Thus, if it is determined in step 311 that repairs are needed, then theycan be made and then those repairs traced using breakaway RFID tags 201.This can be done by scanning breakaway RFID tag 201 as the assemblyenters and/or exits the repair station to record the identifyinginformation of breakaway RFID tag 201 and, optionally, additionalinformation in step 312.

FIG. 4 to the diagram is illustrating an example assembly process for aPCB 200 comprising a breakaway RFID tag 201 in accordance with oneembodiment of the systems and methods described herein. Thus, as can beseen, the assembly process comprises three assembly steps, step 1, step2, and step 3, performed at the PCB level. As PCB 200 enters assemblystep 1, RFID tag 201 can be scanned by an RFID scanner 404. Similarly,as PCB 200 enters step 2 and step 3, RFID tag 201 can again be scannedby an RFID scanner 404. Depending on the embodiment, RFID tag 201 canalso be scanned by an RFID scanner 404 as it exits one or more ofassembly steps 1, 2 and 3.

In addition, RFID scanners 404 can be interfaced with computer stations402. Computer stations 402 can be used to input information related tothe assembly of PCB 200. Any such information, can be associated withinformation scanned from the associated RFID tag 201. Computer stations402 can then be interfaced with a central server 408 so that the scannedinformation, and any information input through a computer terminal 402can be stored in a database 410 interfaced with or included in centralserver 408.

Depending on the embodiment, or on the step in the assembly process,little more than the identifying information, and possibly a time step,can be noted in order to attract the assembly of PCB 200; however, ifthere is a problem in the assembly of PCB 200, then it is oftennecessary to record additional information so that details related tothe problem can be stored in database 410. For example, as illustratedin FIG. 4, PCB 200 may need to enter a repair station during theassembly process. Thus, RFID tag 201 can be scanned as it enters therepair station and information related to the nature of the repairs canbe entered through computer terminal 402 and stored in database 410.

Once PCB 200 has passed through assembly steps 1, 2, and 3, and possiblythe repair station, it can be assembled into a larger component assemblyin the final assembly step for PCB 200. At this point, breakaway RFIDtag 201 can be broken off, or otherwise detached from PCB 200, andattached to the outside of the final assembly 406. RFID tag 201 can thenbe used to track final assembly 406. Such tracking can include, forexample, tracking information related to any repairs made on finalassembly 406 as described above.

It should be noted, that in certain embodiments of RFID scanner 404,RFID scanner 404 can include a computer system. Thus, computer terminal402 may not be needed in order to interface RFID scanner 404 withcentral server 408. Alternatively, even if RFID scanner 404 includes acomputer system, then it can still be interfaced with a computerterminal 402 if required by a particular implementation.

Once RFID tag 201 is attached to the outside of assembly 406, it canremain there and be used even after assembly 406 has been fielded, e.g.,sold to a consumer. FIG. 5 is a flowchart illustrating an example methodfor using RFID tag 201 in order to troubleshoot failures in fieldedunits in accordance with one embodiment of the systems and methodsdescribed herein. Thus, for example, if a unit in the field fails, atechnician can be dispatched in order to service the unit. Thetechnician can begin servicing the unit by scanning breakaway RFID tag201, in step 502, attached to the outside of the unit. In step 504, theinformation scanned can then be used to access information related tothe assembly of the unit. In other words, information stored in database410 can be accessed and used to identify potential problems with thefielded unit. Thus, in step 506, information obtained using the scannedinformation from RFID tag 201 can be used to troubleshoot potentialproblems with the fielded unit. In particular, if PCB 200 went through arepair station, information related to the repairs can be accessed andanalyzed to determine if it is likely that the repairs wereinsufficient.

Moreover, as the technician troubleshoots and services the fielded unit,information related to the servicing can be associated with theinformation scanned from RFID tag 201 and then stored, e.g., in database410. Thus, in step 508, information can be tracked and stored over thelifetime of assembly 406. The information tracked and stored can,however, easily be correlated and stored for efficient retrieval and useover the lifetime of assembly 406.

The information related to servicing of fielded units can be used, forexample, to track failure trends and identify problems in the assemblyprocess. For example, if servicing of a plurality of fielded unitsreveals that the problem is consistently related to portions of PCB 200that went through a repair station, then this information could be usedto ascertain that the repair processes associated with the repairstation are inadequate, or are not being implemented correctly.Similarly, information related to consistent failures in the field canbe used to identify problems in the assembly process that are not beingdetected. This information can then be used to implement processes toidentify such problems and to implement repair stations to correct theproblems when they are identified.

While certain embodiments of the inventions have been described above,it will be understood that the embodiments described are by way ofexample only. Accordingly, the inventions should not be limited based onthe described embodiments. Rather, the scope of the inventions describedherein should only be limited in light of the claims that follow whentaken in conjunction with the above description and accompanyingdrawings.

What is claimed is:
 1. A trackable printed circuit board (PCB),comprising: a main circuit area which is manufactured through a PCBprocess including a plurality of processing steps; a breakaway radiofrequency identification (RFID) tag disposed on the PCB, the breakawayRFID tag comprising a printed antenna and an integrated circuit (IC) padconfigured to receive a RFID transponder IC, wherein the plurality ofprocessing steps include a repair step for performing a repair operationon the trackable PCB at a repair station; and a breakable portionconnecting the main circuit area and the RFID tag, wherein the breakableportion is configured to allow the breakaway RFID tag to be detachedfrom the main circuit area.
 2. The trackable PCB of claim 1, wherein thebreakaway RFID tag is scanned before each of the plurality of processingsteps.
 3. The trackable PCB of claim 1, wherein the breakaway RFID tagis scanned after each of the plurality of processing steps.
 4. Thetrackable PCB of claim 1, wherein the plurality of processing stepsinclude one or more assembly steps for assembling multiple componentsonto the main circuit area.
 5. The trackable PCB of claim 1, wherein thebreakaway RFID tag is configured to be scanned during the PCB processwhen the breakaway RFID tag is attached to the main circuit area andstore information associated with the plurality of processing steps. 6.The trackable PCB of claim 5, wherein the breakaway RFID tag is scannedwhen the trackable PCB enters the repair station.
 7. The trackable PCBof claim 5, wherein the breakaway RFID tag is scanned when the trackablePCB exits the repair station.
 8. The trackable PCB of claim 1, whereinthe stored information includes identification information of thebreakaway RFID tag and a time when the breakaway RFID tag is scanned. 9.The trackable PCB of claim 1, wherein the breakaway RFID tag isconfigured to be detached from the main circuit area and attached to anexterior of an assembly comprising the PCB.
 10. The trackable PCB ofclaim 1, wherein the breakaway RFID tag further comprises an RFIDtransponder disposed on the IC pad.
 11. The trackable PCB of claim 1,wherein the breakable portion is perforated with holes so that thebreakaway RFID tag can be snapped-off from the trackable PCB.
 12. Thetrackable PCB of claim 1, wherein the breakaway RFID tag comprises apassive RFID tag.
 13. The trackable PCB of claim 1, wherein thebreakaway RFID tag comprises an active RFID tag.
 14. The trackable PCBof claim 1, wherein the printed antenna and IC pad are disposed on thebreakable portion.
 15. The trackable PCB of claim 1, wherein thebreakaway RFID tag is configured to store tracking informationassociated with the plurality of processing steps.
 16. The trackable PCBof claim 1, wherein the breakaway RFID tag is configured to store repairinformation of the repair operation performed on the trackable PCB atthe repair station.